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Zunxu Liu

related results about 46.

Vacuum-based picking-up of thin chip …

Zhoulong Xu State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China, Zunxu Liu ...
http://www.tandfonline.com/doi/figure/10.1080/01694243.2015.1026869

Zunxu Liu | Ph.D | ResearchGate

My current research interests include Applied Mechanics, Adhesive Structure, FEA, Peel Mechanics, Fracture Mechanics.
https://www.researchgate.net/profile/Zunxu_Liu

Die separation and rupture strength

Die separation and rupture strength for deep reactive ion etched silicon wafers. ... Zunxu Liu et al 2015 Semiconductor Science and Technology 30 045005
http://iopscience.iop.org/article/10.1088/0960-1317/23/8/085020/meta

ZHAO YACHONG/ LIU ZUNXU/ BU NINGBIN 赵亚冲 刘 …

ZHAO YACHONG/ LIU ZUNXU/ BU NINGBIN 赵亚冲/ 刘尊旭/ 布宁斌 VeinSight 400 Vein Finder 血管显像仪
https://innodesign.fr/.../11/ZHAO-YACHONG-LIU-ZUNXU-BU-NINGBIN-.pdf

Ultrathin Silicon Circuits With Strain …

25/09/2009 · 15 Zunxu Liu, YongAn Huang, Lin Xiao, Pengpeng Tang, Zhouping Yin, Nonlinear characteristics in fracture strength test of ultrathin silicon die, ...
http://onlinelibrary.wiley.com/doi/10.1002/adma.200900405/full

Vacuum-based picking-up of thin chip from adhesive tape

Vacuum-based picking-up of thin chip from adhesive tape Zhoulong Xu, Zunxu Liu, YongAn Huang*, Jiankui Chen , Huimin Liu and Zhouping Yin* State Key Laboratory of ...
https://www.researchgate.net/profile/Zunxu_Liu/publication/...

Die separation and rupture strength for deep reactive …

Zunxu Liu et al-This content was downloaded from IP address 157.55.39.198 on 26/01/2018 at 23:42. IOP PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING
http://iopscience.iop.org/article/10.1088/0960-1317/23/8/085020/pdf

Cohesive failure analysis of an array of IC chips bonded ...

Zunxu Liua, Paolo S. Valvob, ... Z. Liu et al./International Journal of Solids and Structures 50 (2013) 3528–3538 3529. 1 and 2. Local reference axes x
https://core.ac.uk/download/pdf/82394746.pdf

Extremely Flexible Nanoscale Ultrathin …

18/12/2012 · Zunxu Liu, YongAn Huang, Lin Xiao, Pengpeng Tang, Zhouping Yin. Semiconductor Science and Technology 2015 30, 045005. Meniscus-force …
http://pubs.acs.org/doi/abs/10.1021/nl304310x

Paolo Sebastiano Valvo - Professore associato - …

Zunxu Liu, Paolo Sebastiano Valvo, YongAn Huang, Zhouping Yin; An enhanced beam-theory model of the mixed-mode bending (MMB) test - Part I: literature review and ...
https://it.linkedin.com/in/paolo-sebastiano-valvo-50741717